Great Polishing Equipment As Per Your Requirement Now

Mechanical preparation is the most common method of preparing materialographic specimens for microscopic examination. The specific requirements of the prepared surface are determined by the type of analysis or examination envisaged. Samples can be prepared until a perfect finish is achieved to have the true structure, or the preparation can be stopped when the surface is compatible with the desired examination.

Objectives of the Preparation

  • Beyond the requirements of the preparation, the main objectives are listed below.
  • All structural elements must be preserved
  • The surface must be free from scratches and deformations
  • No foreign material should contaminate the surface of the sample
  • The sample should be flat and mirror-polished if possible
  • We are always looking for an optimal cost per sample
  • All preparations must be 100% reproducible

The basic mechanical process of sample preparation is removal of material by means of finer and finer abrasive particles at the surface of the sample until the desired result is obtained.

There are three material removal mechanisms: grinding, polishing and honing. They are differentiated by their tendency to cause deformations on the surface of the sample. You will need the AMAT MIRRA MESA equipment parts now.

The Grinding Is Carried Out In Two Stages

Plan pre-polishing (PG)

This is normally the first step in the grinding process. Grinding ensures that the surfaces of all samples are similar, despite their initial state. In addition, when processing multiple samples on a sample rack, care must be taken to ensure that they are all at the same level (coplanar) before proceeding to the next fine grinding step.

Fine grinding (FG)

Fine grinding provides a surface with such a small deformation that it can be removed by polishing. Due to the drawbacks of abrasive paper, other composite surfaces are available, to improve and facilitate fine grinding, a high material removal rate is obtained using grain sizes 15, 9 or 6 .mu.m. This performance involves the use of hard composite discs (hard discs) whose surface is made of a special composite material.

The Applied Mirra Mesa CMP framework is a computerized dry-in dry-out framework that uses a mix of chemistry and scraped area under control conditions for removing particular measures of material from the wafers surfaces. ThisMirra Mesa conveys industry-driving 200 milimeter CMP on all the polishing applications as well as offers the Applied Material and its integrated cleaner. The Mirra Mesa cleaners incorporate cleaning modules, for example, brush scrub, megasonics and SRD. CMP robots, input transport and strolling bar are the wafers handling components.

The framework incorporates a FABS unit that can oblige up to four 25-wafer tapes, joining a formula and consequently playing out an arrangement to every wafer. The framework’s polishing head enhances consistency over the wafer by tuning film evacuation rate to coordinate particular slurry sciences to control dishing and erosion in elite polishing applications.

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